คำตอบที่ 436
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Spansion TSMC Positions
Jobs in Taiwan
TWN2012 MTS Process Development Engineer
PRIMARY PURPOSE:
Develops Wafer Fab lithography processes for 45nm and 32nm technology nodes that provide more tightly controlled parameters to allow the design of improved device technology or better yield and/or throughput capacity on existing or new device technology.
QUALIFICATIONS:
Detailed proficiency on leading photolithography equipment used in the industry including 193- and 248-nm scanners, coater developer, and photo resist technology.
Strong process engineering skills, with core competencies in resist development, optics, and/or advanced metrology solutions.
Knowledge of semiconductor manufacturing and process integration required.
A technology related Bachelor's degree in engineering, chemistry, physics, or physical sciences required plus 7 years related experience including experience in new process development. A Master's degree plus 5 years experience or doctorate degree is preferred and may reduce the minimum experience required. Advanced degrees in physics or chemistry preferred.
TWN2013 MTS Process Development Engineer
PRIMARY PURPOSE:
Develops Wafer Fab CMP processes for 45nm and 32nm technology nodes that provide more tightly controlled parameters to allow the design of improved device technology or better yield and/or throughput capacity on existing or new device technology. Preferred oxide front end polish experience.
QUALIFICATIONS:
Detailed proficiency on leading CMP equipment used in the industry.
Strong process engineering skills with core competencies in process development, use of advanced metrology and integration with lithography process.
Knowledge of semiconductor manufacturing and process integration required.
A technology related Bachelor's degree in engineering, chemistry, physics, or physical sciences required plus 7 years related experience including experience in new process development. A Master's degree plus 5 years experience or doctorate degree is preferred and may reduce the minimum experience required. Advanced degrees in physics or chemistry preferred.
TWN2014 MTS Process Development Engineer
PRIMARY PURPOSE:
Develops Wafer Fab wet clean processes for 45nm and 32nm technology nodes that provide more tightly controlled parameters to allow the design of improved device technology or better yield and/or throughput capacity on existing or new device technology.
QUALIFICATIONS:
Must have detailed knowledge of wet clean science and process applications. Knowledge of semiconductor manufacturing and process integration required. A technology related Bachelor's degree in engineering, chemistry, physics, or physical sciences required plus 7 years related experience including experience in new process development. A Master's degree plus 5 years experience or doctorate degree is preferred and may reduce the minimum experience required. Advanced degrees in physics or chemistry preferred.
TWN2015 MTS Process Development Engineer
PRIMARY PURPOSE:
Develops Wafer Fab plasma etch processes for 45nm and 32nm technology nodes that provide more tightly controlled parameters to allow the design of improved device technology or better yield and/or throughput capacity on existing or new device technology.
QUALIFICATIONS:
Must have detailed knowledge of etch science and process applications and detailed proficiency on leading plasma etch equipment used in the industry. Strong process engineering skills with core competencies in process development, use of advanced metrology and integration with lithography process.
Knowledge of semiconductor manufacturing and process integration required.
A technology related Bachelor's degree in engineering, chemistry, physics, or physical sciences required plus 7 years related experience including experience in new process development. A Master's degree plus 5 years experience or doctorate degree is preferred and may reduce the minimum experience required. Advanced degrees in physics or chemistry preferred.
TWN2016 MTS Process Development Engineer
PRIMARY PURPOSE:
Develops Wafer Fab film deposition processes for 45nm and 32nm technology nodes that provide more tightly controlled parameters to allow the design of improved device technology or better yield and/or throughput capacity on existing or new device technology.
QUALIFICATIONS:
Must have detailed knowledge of thermal processes, LPCVD, implant and RTA Detailed proficiency on leading thermal processes and implant equipment used in the industry. Strong process engineering skills with core competencies in process development and use of advanced metrology. Knowledge of semiconductor manufacturing and process integration required.
A technology related Bachelor's degree in engineering, chemistry, physics, or physical sciences required plus 7 years related experience including experience in new process development. A Master's degree plus 5 years experience or doctorate degree is preferred and may reduce the minimum experience required. Advanced degrees in physics or chemistry preferred.
TWN2017 MTS Device Technology Engineer
Work with Spansion device, modeling, design, process integration and product engineering experts to develop and verify memory core and logic devices and electrical design rules for new Flash memory technologies. Develop device performance to meet design and product reliability requirements. Responsible for design of experiments, planning experimental test chip and product lots to be run in TSMC Tainan fab, bench testing and analyzing the resulting data in addition to Wafer Electrical Test data. Closely collaborate with Device, Product and Reliability Engineers from both Spansion and TSMC to develop, improve and qualify Flash memory and CMOS devices. Assist to solve manufacturing and targeting issues at fabs.
QUALIFICATIONS:
Masters degree in Electrical Engineering or Physics (or related fields) plus 5 years experience with CMOS device development, or PhD degree in Electrical Engineering or Physics or related fields plus 1 year experience with CMOS device development. Experience with Non-Volatile Memory and advanced devices (including low power) is highly desirable. Solid understanding of semiconductor device behavior and knowledge of layout design. Cross communication with Spansion and TSMC is important.
Knowledge in each of the following:
- Solid State Devices and Device Physics
- Knowledge of bench test systems for device characterization
- Basic knowledge of advanced technology semiconductor process and reliability
TWN2055 MTS Device Technology Engineer
Work with Spansion device, modeling, design, process integration and product engineering experts to develop and verify memory core and logic devices and electrical design rules for new Flash memory technologies. Develop device performance to meet design and product reliability requirements. Responsible for design of experiments, planning experimental test chip and product lots to be run in TSMC Tainan fab, bench testing and analyzing the resulting data in addition to Wafer Electrical Test data. Closely collaborate with Device, Product and Reliability Engineers from both Spansion and TSMC to develop, improve and qualify Flash memory and CMOS devices. Assist to solve manufacturing and targeting issues at fabs.
QUALIFICATIONS:
Masters degree in Electrical Engineering or Physics (or related fields) plus 5 years experience with CMOS device development, or PhD degree in Electrical Engineering or Physics or related fields plus 1 year experience with CMOS device development. Experience with Non-Volatile Memory and advanced devices (including low power) is highly desirable. Solid understanding of semiconductor device behavior and knowledge of layout design. Cross communication with Spansion and TSMC is important.
Knowledge in each of the following:
- Solid State Devices and Device Physics
- Knowledge of bench test systems for device characterization
- Basic knowledge of advanced technology semiconductor process and reliability
TWN2119 Sr. MTS Device Technology Engineer
PRIMARY PURPOSE:
Develops and optimizes complex new device structures including modeling of yield loss and device failure mechanisms. Provides technical support for testing device technology.
KEY FUNCTIONS:
Develop and optimize new device structures including modeling of yield loss and device failure mechanisms. Provide technical support for testing device technology. Design new device technology ensuring that the device reliability and packing density meet product performance specifications. Coordinate with Process Development to ensure that device requirements are met. Provide technical consultation on existing technologies. Understand CAD models and their effect on circuit simulations. Generate mask design rules. Develop models for yield loss mechanisms. Develop and verify physical models of devices.
QUALIFICATIONS:
An MS or Ph.D. (preferred) in Electrical Engineering, Physics, Materials Science or equivalent field with strong device physics background. Experience in Non-Volatile Memory, CMOS technology or advanced process modules is also highly desirable.
TWN2120 Sr. MTS Device Technology Engineer
PRIMARY PURPOSE:
Develops and optimizes the most critical state of the art new device structures including modeling of yield loss and device failure mechanism. Provides technical support for testing device technology.
Works independently in designing major new complex device technologies, ensuring that the Company remains competitive in designing new technologies.
QUALIFICATIONS:
A technology related Bachelor's degree or equivalent combination of training and experience plus 9 years of related experience. A Master's degree plus 7 years experience or a doctorate degree is preferred. Requires demonstrated technical expertise in most critical state-of-the-art device technologies and excellent knowledge of chemistry and physics as they relate to semiconductor development.
TWN2121 MTS Device Technology Engineer
PRIMARY PURPOSE:
Work in Tainan, Taiwan with a team of Spansion and TSMC engineers. Responsible for process and device development and product characterization applying knowledge and principles in semiconductor physics, materials and engineering. Work with process module experts in lithography, etch, films, diffusion, CMP, etc. to develop and verify process flows and design rules for new Flash memory technologies. Develop and continuously improve process modules and process flows. Responsible for design of experiments, develop experimental test chip and product lots to be run in TSMC Tainan fab, and analyze the resulting data.
QUALIFICATIONS:
Masters degree in Electrical Engineering, Physics, Material Science (or related fields) plus 5 years experience with CMOS technology development, or PhD degree in Electrical Engineering, Physics, Materials Science or related fields plus 1 year experience with CMOS technology development. Experience with Non-Volatile Memory and advanced process modules is highly desirable.
Cross communication with Spansion and TSMC is important.
Knowledge in each of the following:
- Solid State Devices and Device Physics
- Advanced CMOS Process Technology and reliability
- Semiconductor Materials and Properties
TWN2123 MTS Product Engineer
PRIMARY PURPOSE:
Provides product characterizations and analysis expertise to support Product, Test, and Design Engineering.
KEY FUNCTIONS:
Provides fundamental characterization support for product/technology changes, testing limitations, product problems, and data sheet verification, including customer correlation.
Develops testing philosophy for generic product families and special adaptations for unique product performance with Test Engineering.
Designs testing flow and guard banding for product families to maximize quality and manufacturability for the product line. Ensures production follows production documentation.
Interacts with Product and Test Engineers to develop test programs for new products.
Monitors yields and provides feedback to related engineering areas and recommends cost reduction.
Serves as technical consultant to other Product Engineers and Marketing.
Directs new package requirements and quality improvement programs.
QUALIFICATIONS:
A technology related Bachelor's degree or equivalent combination of training and experience plus 7 years of related experience. A Master's degree plus 5 years or a doctorate degree is preferred. Requires experience and a demonstrated technical expertise in product design, performance, yield analysis and testing characterization with the ability to organize and lead projects.
